Testing Services

Professional Analysis provides in-house laboratory testing and engineering services to:

  • Test Theories or Claims
  • Reconstruct accidents and failed components
  • Test an item to a given standard

Specific examples of testing experience includes:

  • Aerosol can and dispenser testing (impact, drop, temperature/pressure testing)
  • Conditions under which an item will ignite or explode (chemical reaction or mechanical over-pressure)
  • Crash Data Retrieval (CDR download, “black box”)
  • Vehicle and component performance evaluations
  • Failure modes of electrical components
  • Firearm and firearm safety device testing
  • Puncture resistance of surfaces
  • Appliance performance versus a manufacturer’s specifications
  • Electric and magnetic fields associated with high voltage power lines
  • Area of first impact on a fractured windshield
  • Velocity of projectiles

Professional Analysis can engineer specific tests, determine the necessary instrumentation, ensure tests are conducted in a scientific and reproducible manner, and interpret the results.

We utilize our in-house laboratories and utilize established collaborative relationships with specialized outside laboratories. In this way, our clients benefit from the latest technology, calibrated and properly maintained equipment, and experienced and efficient engineers and technicians.

Our experience includes:

  • 3D Computed Tomography (Industrial x-ray CAT Scan) of components and materials
  • Aerosol can testing
  • Bearing and lubrication performanceMechanical Engineering Expert
  • Bend testing
  • Compression testing
  • Electrical & magnetic field measurements of environments or materials (for static and dynamic measurements)
  • Electrical power distribution testing (Power quality, circuit breaker testing, transformer testing, etc.)
  • Electrical properties of components or circuits from DC to microwave
  • Engine and motor operational analysis (Electric, Gasoline/Diesel, Aircraft)
  • FTIR (Fourier Transform Infrared spectroscopy)
  • High resolution / high accuracy spatial measurements
  • Infrared thermal imaging
  • ICP mass spectroscopy, gas chromatography, mass spectroscopy
  • Atomic absorption for chemical analysis
  • Drone and laser scanning (3D) of scenes and surfaces, including photogrammetry
  • Metallurgical and fracture analysis (including hardness, alloy composition, heat treatment, grain size analysis, etc.)
  • Optical microscopy (both standard and phase contrast)
  • Optical spectroscopy
  • Scanning Electron Microscopy (SEM) with elemental analysis through EDS (Energy Dispersive Spectroscopy)
  • Semiconductor materials characterization (material electrical characterization, photoluminescene, crystal defects, etc.)
  • Sensor based data collection and analysis – Stress, Strain, Force, Pressure, Temperature, etc.
  • Surface analytical techniques (Incl. SIMS, Auger, ESCA, etc.) for composition, contamination, and material properties
  • Transmission Electron Microscopy (TEM)
  • Tensile testing
  • Vibration analysis
  • X-Ray (radiography)


Timothy M. Hicks